| 期刊ISSN: | 0018-1544 | ||
|---|---|---|---|
| E-ISSN: | 1472-3441 | 期刊分类: | |
| 影响因子: | 0.4 | 检索数据库: | |
| 自引率: | 0% | 出版语言: | 英文 |
| 出版信息 | |
|---|---|
| 出版社 | Old City Publishing |
| 期刊官网 | http://www.oldcitypublishing.com/journals/hthp-home/ |
| 涉及的研究方向 | 工程技术、材料科学:表征与测试 |
| 年文章数 | 0 |
| 是否OA | 否 |
| APC费用 | |
| SCI期刊收录coverage | |
| 期刊简介 |
|---|
|
High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.
|
| 最新中科院SCI期刊分区 (基础版) |
|
||||||||
|---|---|---|---|---|---|---|---|---|---|
| 最新中科院SCI期刊分区 (升级版) |
|
| Cite Score相关 | ||||
|---|---|---|---|---|
| Cite Score | Cite Score | SJR | SNIP | 排名 |
IEEE Xplore,EI Compendex
2026年数字能源与转换技术国际研讨会(DECT 2026)IEEE出版
前沿会议
EI Compendex,Scopus,IEEE Xplore
2026年智能系统控制、优化与应用国际学术会议(ISCOA 2026)985主办
IEEE出版
EI Compendex,Scopus
2026年高端装备与智能机器人国际学术会议 (ICAEIR 2026)交叉学科
官方推荐
EI Compendex,Scopus
第二届能源互联网与电气工程国际学术会议(EIEE 2026)IEEE出版
热门会议
EI Compendex,Scopus,IEEE Xplore
第二届先进计算与智能机器人应用国际学术会议 (ACIRA 2026)IEEE出版
985主办
EI Compendex,Scopus,IEEE Xplore
第二届算法、软件与网络安全国际学术会议(ASNS2026)官方推荐
IEEE出版
EI Compendex,Scopus
2026年工业工程与智能制造国际学术会议 (ICIEIM 2026)新会上线
前沿会议
EI Compendex,Scopus,IEEE Xplore
第三届大数据分析与人工智能应用国际学术会议(BDAIA 2026)交叉学科
IEEE出版